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LDS8160
– register 49h, bit3 – bit0 (every LSB is equal 5 C
bit7 – bit4 (every LSB is equal 5 C offset, with +35oC
For comparison, the second curve is the “ideal” curve
obtained if ? =1 and R S = 0 (with the same V F turn on
voltage).
Figure A3.1: I-V characteristic for Nichia WLED diode
(NSSW020BT-P1
The LDS8160 implements LED temperature
measurement using two low currents during PWM off
time. Low currents are used to avoid error due high
LED’ R S value and LED heating during measurement.
The sampling time is ~ 125usec per LED sensed
every 2.5 sec. The interruption and change in the
average LED current is ~ 0.015% in the sampling
period and ~0.6% error in the local 20msec time
window of the measured sample. This is below the
level to have any visual effect.
LDS8160 allows LED sensing on three LED driver
channels (1 per each bank or color channel). The
temperature may be measured on any LED (R, G, B,
WLED, or other) connected to the LEDA1, LEDB1, or
LEDC1 driver channels. This allows users to
determine the junction temperature for one LED for
each of the three Banks (or color channels).
Additional correction, based on measurements of an
on-chip silicon diode’s temperature data, improves
measurement precision.
The LDS8160 performs a calibration routine at start-
up to determine the ideality factor ? for the LEDs
used. In addition, this calibration process may be
conducted at user (system) defined operating points.
During the calibration sequence, the junction
temperature Tj of the on-chip silicon diode is
measured and the ambient temperature Ta is
obtained by applying a stored offset between Tj and
Ta. This offset depends on LDS8160 package
thermal resistance, the user selected operating
condition, and the device power levels during the
calibration sequence. Factory defaults are provided
but can be reprogrammed by the user.
A thermal related package offset for the LEDs must
also be stored (based on LED vendor thermal data)
to further correlate LED Tj with the silicon diode Tj
and the Ta during the calibration process.
This additional LED based package offset should be
loaded by the user, based on user’s selection of
LEDs and operating conditions during the desired
calibration sequence.
The user decides the operating condition for running
the calibration sequence, and initiates a calibration
command by writing bit 4 of Register 1Fh to “1” (the
bit resets automatically upon completion).
If the calibration starts prior to setting currents to the
LEDs, (i.e. after the power-on initialization sequence
for the LDS8160), then during the calibration period,
we assume that the ambient temperature, Ta, is the
same for both the on-chip diode and the LEDs (since
no DC current flow in LEDs, there is no appreciable
temperature offset incurred).
The LEDs also have a typical offset between junction
and ambient temperature, which is applied to obtain
the reference LED Tj used for calibrating the ideality
factor as prior discussed.
The LDS8160 is delivered with factory-preset values,
however, the user must load LED specific parameters
and recommended factory values for the internal
silicon diode.
Ta-Tj Temperature Offset adjustment for silicon diode
0
offset, with +35oC to -40oC range);
Ta-Tj Temperature Offset for LEDs – register 49h,
0
to -40oC range););
Silicon diode V F temperature coefficient – register
A0h, bit 7 – bit0; factory recommended load value dis
-1.71 mV/°C = 00110110 (bin) = 36h
Silicon diode ideality coefficient – register C0h;
factory recommended load values is 1.000 =
01000000(bin) = 40h
Temperature Offset between Tj and Ta for LED –
register D0h (user loaded) - correction from ambient
temperature to LED junction temperature; factory
default = 04h.
Temperature Offset between Tj and Ta for silicon
diode – register D2h, correction for LDS8160
package thermal characteristics; factory default =02h.
LEDs Rs value (user loaded) for Banks A, B, and C
registers D6h, D8h, and DAh respectively.
? 2009 IXYS Corp.
Characteristics subject to change without notice
32
Doc. No. 8160_DS, Rev. N1.0
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